QYResearch:预计到2022年底,全球焊球市场收入2.9484亿美元(中英)

QYResearch2018-12-05 13:32:21

焊球



根据该报告,2016年全球焊球市场收入为2.2012亿美元,预计到2022年底将实现收入2.9484亿美元,2016年至2022年的复合年增长率略高于6.6% 。2017年全球测量产量的焊球市场达到212,2079万个,比上年同期增长9.22%。


亚太地区在2016年的收入中占据领先的份额。我们估计全球焊球的市场份额台湾为27.66%,韩国20.54%,日本17.28%,中国15%和10.56在东南亚%。由于ASE,Amkor,SPIL等公司在这些地区有较大规模的IC封装(包括测试)公司,因此焊球最适合用于球栅阵列,多芯片模块,芯片上的倒装芯片和CSP。


Senju Metal,DS HiMetal和MKE在2016年获得了焊球市场前三大收入份额。Senju金属占据40.00%的收入份额,其次是DS HiMetal,收入份额为19.14%,MKE收入份额为7.08%。


在主要合金类别中,无铅焊球占2016年市场份额首位,预计在估计期间将主导市场。该行业2016年至2022年的复合年增长率可能会高达9.92%。

恒州博智发表 Global Solder Ball Market Professional Survey Report 2017 该报告提供了焊球行业的基本概况,包括定义,分类,应用和产业链结构。讨论发展政策和计划以及制造流程和成本结构。


报告重点关注全球主要地区行业参与者,包括公司简介,产品图片和规格,销售,市场份额和联系信息等信息。更重要的是,分析了焊球行业发展趋势和营销渠道。提供了关于行业现状的主要统计数据,对于对市场有兴趣的公司和个人来说是一个宝贵的指导和方向。


报告详细内容可复制浏览该网页:http://www.qyresearchglobal.com/goods-1199399.html



According to the report, global revenue for Solder Ball market was valued at $ 200.12 million in 2016, and is expected to generate revenue of $ 294.83 million by end of 2022, growing at a CAGR of slightly above 6.6 % between 2016 and 2022. Solder Ball market by volume, which measures output worldwide, was expected to reach 2122079 Million Units in 2017 with an increase of 9.22 % from its year-earlier level.


Asia Pacific held the leading share of the market in terms of revenue in 2016. We estimate that the global market share of Solder Ball is 27.66% in Taiwan, 20.54% in Korea, 17.28% in Japan, 15% in China and 10.56% in South East Asia. Because there are many larger IC packaging (including testing) companies in these region, such as ASE, Amkor, SPIL etc. Solder Ball are most suitable for Ball Grid Array, Multi-Chip Module, Chip On board Flip Chip and CSP.


Senju Metal, DS HiMetal and MKE captured the top three revenue share spots in the Solder Ball market in 2016. Senju Metal dominated with 40.00% revenue share, followed by DS HiMetal with 19.14% revenue share and MKE with 7.08% revenue share.


Amongst the key alloy type segments, lead free Solder Ball accounted for the leading share in the market in 2016 and is projected to dominate the market over the estimated period. This sector is likely to rise at a CAGR of 9.92% from 2016 to 2022.

The Global Solder Ball Market Professional Survey Report 2017 report released by QYResearch provides a basic overview of the Solder Ball industry, including definition, classification, application and industrial chain structure. Discuss development policies and plans as well as manufacturing processes and cost structures.


The report then focuses on major industry players in Global, including company profiles, product images and specifications, sales, market share, and contact information. More importantly, the Solder Ball industry development trends and marketing channels were analyzed. Providing the main statistical data on the current status of the industry is a valuable guide and direction for companies and individuals interested in the market.


The details of the report can be copied to browse this page:http://www.qyresearchglobal.com/goods-1199399.html


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